UPB100474AD-7
vs
MBM10474A-7CZ
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
Package Description |
0.400 INCH, CERDIP-24
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
7 ns
|
7 ns
|
JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX4
|
1KX4
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.84 mm
|
Surface Mount |
NO
|
NO
|
Technology |
ECL
|
TTL
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
10.16 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
Length |
|
30.3 mm
|
|
|
|
Compare UPB100474AD-7 with alternatives
Compare MBM10474A-7CZ with alternatives