UPA812T vs BFM520,115 feature comparison

UPA812T NEC Compound Semiconductor Devices Ltd

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BFM520,115 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NEC COMPOUND SEMICONDUCTOR DEVICES LTD NXP SEMICONDUCTORS
Package Description PLASTIC, SO-6 PLASTIC, S-MINI, SC-88, 6 PIN
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Additional Feature LOW NOISE LOW NOISE, HIGH RELIABILITY
Collector Current-Max (IC) 0.065 A 0.07 A
Collector-Base Capacitance-Max 0.9 pF
Collector-Emitter Voltage-Max 10 V 8 V
Configuration SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS
Highest Frequency Band ULTRA HIGH FREQUENCY BAND L BAND
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e0 e3
Number of Elements 2 2
Number of Terminals 6 6
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 7000 MHz 9000 MHz
Base Number Matches 4 1
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363
HTS Code 8541.21.00.75
Samacsys Manufacturer NXP
DC Current Gain-Min (hFE) 60
Operating Temperature-Max 175 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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