UMX4010C
vs
UMX4010DR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
ROHS COMPLIANT PACKAGE-1
|
ROHS COMPLIANT PACKAGE-2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
Application |
ATTENUATOR; SWITCHING
|
ATTENUATOR; SWITCHING
|
Breakdown Voltage-Min |
1000 V
|
1000 V
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
3 pF
|
3 pF
|
Diode Capacitance-Nom |
2.4 pF
|
2.4 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
0.5 Ω
|
0.5 Ω
|
Diode Res Test Current |
100 mA
|
100 mA
|
Diode Res Test Frequency |
100 MHz
|
100 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
Frequency Band |
HIGH FREQUENCY TO S BAND
|
HIGH FREQUENCY TO S BAND
|
JESD-30 Code |
O-XUPM-N1
|
O-CRPM-F2
|
JESD-609 Code |
e3
|
|
Minority Carrier Lifetime-Nom |
10 µs
|
10 µs
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Dissipation-Max |
25 W
|
18.75 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
100 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Form |
NO LEAD
|
FLAT
|
Terminal Position |
UPPER
|
RADIAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare UMX4010C with alternatives
Compare UMX4010DR with alternatives