ULS2003H
vs
DS2003TN/NOPB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-16
|
IN-LINE, R-PDIP-T16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
HIGH RELIABILITY
|
LOGIC LEVEL COMPATIBLE
|
| Collector Current-Max (IC) |
0.5 A
|
0.5 A
|
| Collector-Emitter Voltage-Max |
50 V
|
55 V
|
| Configuration |
COMPLEX
|
COMPLEX
|
| JESD-30 Code |
R-CDIP-T16
|
R-PDIP-T16
|
| Number of Elements |
7
|
7
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
105 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| VCEsat-Max |
|
1.6 V
|
|
|
|
Compare ULS2003H with alternatives
Compare DS2003TN/NOPB with alternatives