UL635H256SK55G1
vs
STK11C88-3S55
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ZENTRUM MIKROELEKTRONIK DRESDEN AG
SIMTEK CORP
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP28,.3
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
JESD-609 Code
e3
e0
Length
18.1 mm
18.085 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
8.75 mm
8.765 mm
Base Number Matches
1
2
Additional Feature
STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM
Package Equivalence Code
SOP28,.3
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.001 A
Supply Current-Max
0.035 mA
Compare UL635H256SK55G1 with alternatives
Compare STK11C88-3S55 with alternatives