UL634H256BSK55G1 vs UL635H256BTC45 feature comparison

UL634H256BSK55G1 ZMDI

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UL635H256BTC45 ZMDI

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code SOIC TSOP1
Package Description SOP, TSOP1, TSSOP32,.8,20
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 45 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e3 e0
Length 20.725 mm 18.4 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Width 7.51 mm 8 mm
Base Number Matches 1 2
Package Equivalence Code TSSOP32,.8,20
Standby Current-Max 0.001 A
Supply Current-Max 0.035 mA

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