UL62H256BSK35 vs UL62H256BSA35G1 feature comparison

UL62H256BSK35 ZMDI

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UL62H256BSA35G1 ZMDI

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0 e3
Length 17.9 mm 17.9 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 2 1

Compare UL62H256BSK35 with alternatives

Compare UL62H256BSA35G1 with alternatives