UL62H1708BSA35
vs
UL62H1708BSK35
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALLIANCE MEMORY INC
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
20.445 mm
20.445 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
3 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
11.3 mm
11.3 mm
Base Number Matches
4
4
JESD-609 Code
e0
Moisture Sensitivity Level
3
Terminal Finish
Tin/Lead (Sn/Pb)
Compare UL62H1708BSA35 with alternatives
Compare UL62H1708BSK35 with alternatives