UF5402G
vs
MR852GP
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
FAGOR ELECTRONICA S COOP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW POWER LOSS
|
|
Application |
EFFICIENCY
|
FAST RECOVERY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1 V
|
1.25 V
|
JEDEC-95 Code |
DO-201AD
|
DO-201AD
|
JESD-30 Code |
O-PALF-W2
|
O-PALF-W2
|
Non-rep Pk Forward Current-Max |
45 A
|
100 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
-65 °C
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
Reverse Current-Max |
10 µA
|
5 µA
|
Reverse Recovery Time-Max |
0.035 µs
|
0.15 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
10
|
1
|
Pbfree Code |
|
No
|
Package Description |
|
PLASTIC PACKAGE-2
|
JESD-609 Code |
|
e3
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
IEC-134
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
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