UES806E3
vs
BYX30-300R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
PHILIPS SEMICONDUCTORS
Package Description
HERMETIC SEALED, METAL, DO-5, 2 PIN
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
Application
EFFICIENCY
Case Connection
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.25 V
3.2 V
JEDEC-95 Code
DO-203AB
JESD-30 Code
O-MUPM-D1
Non-rep Pk Forward Current-Max
600 A
250 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
1
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
Output Current-Max
50 A
7.5 A
Package Body Material
METAL
Package Shape
ROUND
Package Style
POST/STUD MOUNT
Reverse Current-Max
70 µA
Reverse Recovery Time-Max
0.05 µs
0.2 µs
Surface Mount
NO
NO
Terminal Form
SOLDER LUG
Terminal Position
UPPER
Base Number Matches
1
4
Rep Pk Reverse Voltage-Max
300 V
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