UES804
vs
BYX30-200R
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
PHILIPS COMPONENTS
|
| Part Package Code |
DO-5
|
|
| Package Description |
HERMETIC SEALED, METAL, DO-5, 2 PIN
|
O-MUPM-D1
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
EFFICIENCY
|
FAST SOFT RECOVERY
|
| Case Connection |
CATHODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
3.2 V
|
| JEDEC-95 Code |
DO-203AB
|
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
600 A
|
250 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
50 A
|
14 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
200 V
|
|
| Reverse Current-Max |
70 µA
|
4000 µA
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.2 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
11
|
1
|
| Additional Feature |
|
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
| Technology |
|
AVALANCHE
|
|
|
|
Compare UES804 with alternatives
Compare BYX30-200R with alternatives