UC3845BD1G
vs
CS3843BGN8
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
CHERRY SEMICONDUCTOR CORP
|
Part Package Code |
SOIC-8 Narrow Body
|
|
Package Description |
ROHS COMPLIANT, SOIC-8
|
PLASTIC, DIP-8
|
Pin Count |
8
|
|
Manufacturer Package Code |
751-07
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
25 V
|
25 V
|
Input Voltage-Min |
12 V
|
12 V
|
Input Voltage-Nom |
15 V
|
15 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.9 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Surface Mount |
YES
|
NO
|
Switcher Configuration |
SINGLE
|
BUCK
|
Switching Frequency-Max |
275 kHz
|
500 kHz
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
|
|
|
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