UAA3545HL/C1,118
vs
ML5800DM
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
RF MICRO DEVICES INC
Part Package Code
QFP
QFJ
Package Description
LFQFP,
HQCCN,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
JESD-30 Code
S-PQFP-G32
S-PQCC-N32
Length
5 mm
5 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
60 °C
60 °C
Operating Temperature-Min
-10 °C
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
HQCCN
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.05 mm
Supply Current-Max
44 mA
90 mA
Supply Voltage-Nom
3.2 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
Telecom IC Type
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
5 mm
5 mm
Base Number Matches
1
1
Compare UAA3545HL/C1,118 with alternatives
Compare ML5800DM with alternatives