UAA2067G/C1
vs
W9009
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PULSE ELECTRONICS CORP
|
Part Package Code |
QFP
|
|
Package Description |
LFQFP,
|
ROHS COMPLIANT
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PQFP-G32
|
|
Length |
5 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
32
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-30 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LFQFP
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
|
Supply Voltage-Nom |
3.6 V
|
|
Surface Mount |
YES
|
|
Technology |
BICMOS
|
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
|
Temperature Grade |
OTHER
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Width |
5 mm
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Additional Feature |
|
AEINC826
|
Connector Type |
|
INTERCONNECTION DEVICE
|
|
|
|
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