U635H64BS2K25G1
vs
U635H64BS2C45
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ZENTRUM MIKROELEKTRONIK DRESDEN AG
|
ZENTRUM MIKROELEKTRONIK DRESDEN AG
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP28,.5
|
SOP, SOP28,.5
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
45 ns
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e0
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
NON-VOLATILE SRAM
|
NON-VOLATILE SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP28,.5
|
SOP28,.5
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.85 mm
|
2.85 mm
|
Standby Current-Max |
0.003 A
|
0.003 A
|
Supply Current-Max |
0.095 mA
|
0.075 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
8.405 mm
|
8.405 mm
|
Base Number Matches |
3
|
3
|
|
|
|
Compare U635H64BS2K25G1 with alternatives
Compare U635H64BS2C45 with alternatives