U635H64BDK35G1
vs
U635H64BD1K35G1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIMTEK CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Package Description
DIP,
DIP, DIP28,.6
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e3
e3
Length
34.7 mm
37.1 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
15.24 mm
Base Number Matches
3
3
Rohs Code
Part Package Code
DIP
Pin Count
28
Moisture Sensitivity Level
3
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.003 A
Supply Current-Max
0.085 mA
Compare U635H64BDK35G1 with alternatives
Compare U635H64BD1K35G1 with alternatives