U635H256D1C35 vs U635H256DC35 feature comparison

U635H256D1C35 Cypress Semiconductor

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U635H256DC35 Cypress Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP SIMTEK CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.3
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Alternate Memory Width 1 1
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.1 mm 34.7 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Standby Current-Max 0.036 A 0.036 A
Supply Current-Max 0.075 mA 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.62 mm
Base Number Matches 3 3

Compare U635H256D1C35 with alternatives

Compare U635H256DC35 with alternatives