U635H256CDK35
vs
U634H256CD1C45G1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIMTEK CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.3
DIP,
Pin Count
28
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
45 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T32
JESD-609 Code
e0
e3
Length
34.7 mm
41.91 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
4.83 mm
Standby Current-Max
0.003 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
3
3
Moisture Sensitivity Level
3
Compare U635H256CDK35 with alternatives
Compare U634H256CD1C45G1 with alternatives