U635H16BSK35
vs
6116SA25SO8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ZENTRUM MIKROELEKTRONIK DRESDEN AG
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP24,.4
0.300 INCH, SOIC-24
Pin Count
24
24
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
25 ns
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e0
e0
Length
15.4 mm
15.4 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
NON-VOLATILE SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Ports
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP24,.4
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.65 mm
Standby Current-Max
0.003 A
0.002 A
Supply Current-Max
0.085 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.5 mm
Base Number Matches
3
1
I/O Type
COMMON
Peak Reflow Temperature (Cel)
225
Standby Voltage-Min
4.5 V
Time@Peak Reflow Temperature-Max (s)
30
Compare U635H16BSK35 with alternatives
Compare 6116SA25SO8 with alternatives