U635H16BD1K45G1 vs U635H16BDC45G1 feature comparison

U635H16BD1K45G1 ZMDI

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U635H16BDC45G1 Cypress Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG SIMTEK CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.6
Pin Count 28 24
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T24
JESD-609 Code e3 e3
Length 37.1 mm 31.95 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 3
Package Equivalence Code DIP24,.6
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.003 A
Supply Current-Max 0.075 mA

Compare U635H16BD1K45G1 with alternatives

Compare U635H16BDC45G1 with alternatives