U635H16BD1C25 vs U635H16BD1C25G1 feature comparison

U635H16BD1C25 Cypress Semiconductor

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U635H16BD1C25G1 ZMDI

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Pbfree Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIMTEK CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e3
Length 37.1 mm 37.1 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 3 3
Rohs Code Yes
Moisture Sensitivity Level 3
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES

Compare U635H16BD1C25 with alternatives

Compare U635H16BD1C25G1 with alternatives