U634H256CD1C35G1 vs U634H256CD1K45G1 feature comparison

U634H256CD1C35G1 Cypress Semiconductor

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U634H256CD1K45G1 ZMDI

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Pbfree Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIMTEK CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 45 ns
JESD-30 Code R-PDIP-T32 R-PDIP-T32
JESD-609 Code e3 e3
Length 41.91 mm 41.91 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.83 mm 4.83 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 3 3
Rohs Code Yes
Moisture Sensitivity Level 3

Compare U634H256CD1C35G1 with alternatives

Compare U634H256CD1K45G1 with alternatives