U633H04DK45G1
vs
U630H04DK45
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIMTEK CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP28,.3
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
45 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Length
34.7 mm
34.7 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
512X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP28,.3
Standby Current-Max
0.001 A
Supply Current-Max
0.08 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare U633H04DK45G1 with alternatives
Compare U630H04DK45 with alternatives