U630H64BDK45 vs 5962-9232405MXC feature comparison

U630H64BDK45 Simtek Corporation

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5962-9232405MXC Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP CYPRESS SEMICONDUCTOR CORP
Package Description DIP, 0.300 INCH, CERAMIC, DIP-28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e0 e4
Length 34.67 mm 35.56 mm
Memory Density 65536 bit 65536 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.14 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Part Package Code DIP
Pin Count 28
Additional Feature SOFTWARE STORE/RECALL
Moisture Sensitivity Level 1
Package Equivalence Code DIP28,.3
Screening Level MIL-STD-883
Standby Current-Max 0.002 A
Supply Current-Max 0.075 mA

Compare U630H64BDK45 with alternatives

Compare 5962-9232405MXC with alternatives