U630H16BDC25
vs
U630H16BD1K25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIMTEK CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Package Description
DIP, DIP28,.3
DIP, DIP28,.6
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
kg CO2e/kg
12
12
Average Weight (mg)
6890.8
6890.8
CO2e (mg)
82689.598
82689.598
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Industrial: -40C to +85C
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
34.7 mm
37.1 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
5.1 mm
Standby Current-Max
0.001 A
0.001 A
Supply Current-Max
0.09 mA
0.095 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
3
3
Pbfree Code
Part Package Code
DIP
Pin Count
28
Candidate List Date
2015-06-15
Moisture Sensitivity Level
3
Compare U630H16BDC25 with alternatives
Compare U630H16BD1K25 with alternatives