U630H16BD1C25 vs U630H16BD1C25 feature comparison

U630H16BD1C25 ZMDI

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U630H16BD1C25 Simtek Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG SIMTEK CORP
Part Package Code DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.1 mm 37.1 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Standby Current-Max 0.001 A 0.001 A
Supply Current-Max 0.09 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) 240

Compare U630H16BD1C25 with alternatives

Compare U630H16BD1C25 with alternatives