U630H04BD1K45G1
vs
U630H04BSK25G1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIMTEK CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Package Description
DIP,
SOP,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
25 ns
JESD-30 Code
R-PDIP-T28
R-PDSO-G24
Length
37.1 mm
15.4 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
24
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
512X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
2.65 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.5 mm
Base Number Matches
3
3
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
24
JESD-609 Code
e3
Moisture Sensitivity Level
3
Terminal Finish
MATTE TIN
Compare U630H04BD1K45G1 with alternatives
Compare U630H04BSK25G1 with alternatives