U62H256SA55G1 vs U62H256SK55 feature comparison

U62H256SA55G1 Alliance Memory Inc

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U62H256SK55 Cypress Semiconductor

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Pbfree Code Yes No
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC SIMTEK CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Length 17.9 mm 17.9 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.5 mm 7.5 mm
Base Number Matches 4 4
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare U62H256SA55G1 with alternatives

Compare U62H256SK55 with alternatives