TZMC51-M-18
vs
JAN1N4994CUS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
VISHAY SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Part Package Code
MELF
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
125 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e2
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
51 V
330 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN SILVER
Tin/Lead (Sn/Pb)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
10
Voltage Tol-Max
5%
2%
Working Test Current
2.5 mA
4 mA
Base Number Matches
2
3
Rohs Code
Factory Lead Time
28 Weeks
Reference Standard
MIL-19500/356H
Compare TZMC51-M-18 with alternatives
Compare JAN1N4994CUS with alternatives