TXC-03701-AIPL
vs
MT9076BPR1
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TRANSWITCH CORP
|
MICROSEMI CORP
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCJ, LDCC68,1.0SQ
|
LEAD FREE, PLASTIC, MS-018AE, LCC-68
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
e3
|
Length |
24.2062 mm
|
24.23 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC68,1.0SQ
|
LDCC68,1.0SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
180 mA
|
0.098 mA
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.2062 mm
|
24.23 mm
|
Base Number Matches |
1
|
3
|
Carrier Type |
|
CEPT PCM-30/E-1
|
Carrier Type (2) |
|
T-1(DS1)
|
Seated Height-Max |
|
4.57 mm
|
|
|
|
Compare TXC-03701-AIPL with alternatives
Compare MT9076BPR1 with alternatives