TUSB8044RGCT
vs
TUSB8041IPAPQ1
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
HVQCCN,
|
HTQFP-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-06-15
|
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
ALSO HAVING SECONDARY DIGITAL SUPPLY 3.3V(TYP), 24 MHZ CRYSTAL INPUT
|
|
Address Bus Width |
|
|
Bus Compatibility |
I2C; SMBUS; VBUS; VGA
|
I2C; SMBUS
|
Clock Frequency-Max |
24 MHz
|
24 MHz
|
Data Transfer Rate-Max |
625 MBps
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N64
|
S-PQFP-G64
|
JESD-609 Code |
e4
|
e4
|
Length |
9 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HTFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
0.99 V
|
0.99 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
9 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare TUSB8044RGCT with alternatives
Compare TUSB8041IPAPQ1 with alternatives