TSXPC860SRVZQU66D
vs
MPC860SRCVR66D4
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
25 X 25 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-357
|
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
|
| Pin Count |
357
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B357
|
S-PBGA-B357
|
| Length |
25 mm
|
25 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
357
|
357
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.75 mm
|
2.52 mm
|
| Speed |
66 MHz
|
66 MHz
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
25 mm
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.A.2
|
| Factory Lead Time |
|
4 Weeks
|
| Clock Frequency-Max |
|
50 MHz
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TSXPC860SRVZQU66D with alternatives
Compare MPC860SRCVR66D4 with alternatives