TSXPC860MHVZPU50C
vs
MPC860DTZQ50D4
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XBGA-B357
|
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
357
|
|
| Operating Temperature-Max |
110 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA357,19X19,50
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
,
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
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