TSXPC603EMGB/C4LL vs TSXPC603EMGU4LL feature comparison

TSXPC603EMGB/C4LL Atmel Corporation

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TSXPC603EMGU4LL Atmel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 255 255
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B255 S-CBGA-B255
Length 21 mm 21 mm
Low Power Mode YES YES
Number of Terminals 255 255
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 3.16 mm 3.16 mm
Speed 120 MHz 120 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 21 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare TSXPC603EMGB/C4LL with alternatives

Compare TSXPC603EMGU4LL with alternatives