TSXC750AMGU/T8LH
vs
PC755BMGS300LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
BGA
CGA
Package Description
,
CGA,
Pin Count
360
360
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.3 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-C360
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
CGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
200 MHz
300 MHz
Supply Voltage-Max
2.7 V
2.1 V
Supply Voltage-Min
2.5 V
1.8 V
Supply Voltage-Nom
2.6 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
BALL
C BEND
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Length
25 mm
Terminal Pitch
1.27 mm
Width
25 mm
Compare TSXC750AMGU/T8LH with alternatives
Compare PC755BMGS300LE with alternatives