TSX68C000VF110A
vs
MQ80C186-12
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
CERAMIC, QFP-68
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
20
|
| Bit Size |
32
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
10 MHz
|
25 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-CQFP-G68
|
S-CQFP-G68
|
| Length |
24.13 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
10 MHz
|
12.5 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Number of DMA Channels |
|
2
|
| Number of External Interrupts |
|
5
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| Package Equivalence Code |
|
QFL68,.95SQ
|
| RAM (words) |
|
0
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Supply Current-Max |
|
160 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TSX68C000VF110A with alternatives
Compare MQ80C186-12 with alternatives