TSX68C000VC1B/C12.5A
vs
TS68C000MC1B/C12A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
E2V TECHNOLOGIES PLC
ATMEL CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
12.5 MHz
12.5 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T64
R-CDIP-T64
Length
81.28 mm
81.28 mm
Low Power Mode
NO
NO
Number of Terminals
64
64
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883 Class B
Seated Height-Max
4.83 mm
4.83 mm
Speed
12.5 MHz
12.5 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HCMOS
HCMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
ECCN Code
3A001.A.2.C
Compare TSX68C000VC1B/C12.5A with alternatives
Compare TS68C000MC1B/C12A with alternatives