TSX68040MF33
vs
KU80486SLENHANCED1XCLKDX33
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
INTEL CORP
Part Package Code
QFP
QFP
Package Description
,
BQFP,
Pin Count
196
196
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33 MHz
33 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CQFP-G196
S-PQFP-G196
Number of Terminals
196
196
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QFP
BQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, BUMPER
Qualification Status
Not Qualified
Not Qualified
Speed
33 MHz
33 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Additional Feature
DYNAMIC BUS SIZING; BURST BUS; MULTIPROCESSOR SUPPORT; ADVANCED POWER MANAGEMENT FEATURES
Length
34.29 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
4
Number of Serial I/Os
On Chip Data RAM Width
Operating Temperature-Max
85 °C
RAM (words)
0
Seated Height-Max
4.57 mm
Supply Current-Max
630 mA
Temperature Grade
OTHER
Terminal Pitch
0.635 mm
Width
34.29 mm
Compare TSX68040MF33 with alternatives
Compare KU80486SLENHANCED1XCLKDX33 with alternatives