TSSA3U60ME3G
vs
FM360-AS
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
FORMOSA MICROSEMI CO LTD
|
Package Description |
SMA, 2 PIN
|
SMA-S, 2 PIN
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW POWER LOSS
|
LOW POWER LOSS
|
Application |
EFFICIENCY
|
EFFICIENCY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.54 V
|
0.7 V
|
JEDEC-95 Code |
DO-214AC
|
DO-214AC
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-F2
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
70 A
|
80 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Rep Pk Reverse Voltage-Max |
60 V
|
60 V
|
Reverse Current-Max |
500 µA
|
500 µA
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
C BEND
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
|
|
|
Compare TSSA3U60ME3G with alternatives
Compare FM360-AS with alternatives