TSS933EBM883
vs
DS2182AQN
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ATMEL CORP
|
DALLAS SEMICONDUCTOR
|
Part Package Code |
QLCC
|
|
Package Description |
QCCN,
|
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-CQCC-N28
|
S-PQCC-J28
|
Length |
11.49 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.03 mm
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.49 mm
|
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TSS933EBM883 with alternatives