TSS933BM
vs
DS2182QN+
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
LCC-28
|
PLASTIC, LCC-28
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
S-XQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
QCCJ
|
Package Equivalence Code |
LCC28,.45SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
QLCC
|
Pin Count |
|
28
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
4 Weeks
|
Length |
|
11.5062 mm
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
4.57 mm
|
Width |
|
11.5062 mm
|
|
|
|
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