TSS901EMCP883
vs
TSS901EMAMV
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
DIE
|
QFP
|
| Package Description |
DIE,
|
QFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
8
|
8
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Communication Protocol |
ASYNC, BIT; SYNC, BYTE
|
ASYNC, BIT; SYNC, BYTE
|
| Data Transfer Rate-Max |
25 MBps
|
25 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
X-XUUC-N
|
S-XQFP-G196
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
3
|
3
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
QFP
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Pin Count |
|
196
|
| Number of Terminals |
|
196
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
|
2.95 mm
|
| Terminal Pitch |
|
0.635 mm
|
|
|
|
Compare TSS901EMCP883 with alternatives
Compare TSS901EMAMV with alternatives