TSS901EMAMQ vs TSS901ESCSL2 feature comparison

TSS901EMAMQ Atmel Corporation

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TSS901ESCSL2 Atmel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code QFP DIE
Package Description QFP, DIE,
Pin Count 196
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 8 8
Boundary Scan YES YES
Clock Frequency-Max 25 MHz 25 MHz
Communication Protocol ASYNC, BIT; SYNC, BYTE ASYNC, BIT; SYNC, BYTE
Data Transfer Rate-Max 25 MBps 25 MBps
External Data Bus Width 32 32
JESD-30 Code S-XQFP-G196 X-XUUC-N
Low Power Mode YES YES
Number of Serial I/Os 3 3
Number of Terminals 196
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code QFP DIE
Package Shape SQUARE UNSPECIFIED
Package Style FLATPACK UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.95 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.635 mm
Terminal Position QUAD UPPER
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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