TSS901EASC vs TSS901ESCSL2 feature comparison

TSS901EASC Atmel Corporation

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TSS901ESCSL2 Atmel Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code QFP DIE
Package Description QFP, QFP196,1.5SQ DIE,
Pin Count 196
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 8 8
Boundary Scan YES YES
Clock Frequency-Max 25 MHz 25 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT; SYNC, BYTE
Data Transfer Rate-Max 25 MBps 25 MBps
External Data Bus Width 32 32
JESD-30 Code S-PQFP-G196 X-XUUC-N
JESD-609 Code e0
Low Power Mode NO YES
Number of Serial I/Os 3 3
Number of Terminals 196
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code QFP DIE
Package Equivalence Code QFP196,1.5SQ
Package Shape SQUARE UNSPECIFIED
Package Style FLATPACK UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.95 mm
Supply Current-Max 190 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.635 mm
Terminal Position QUAD UPPER
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1

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Compare TSS901ESCSL2 with alternatives