TSR8MK303V vs TSR8NK303V feature comparison

TSR8MK303V Tateyama Kagaku Group

Buy Now Datasheet

TSR8NK303V Tateyama Kagaku Group

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TATEYAMA KAGAKU GROUP TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature AEC-Q200, ANTI-SULFUR
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TAPE Tape
Rated Power Dissipation (P) 0.33 W 0.33 W
Rated Temperature 70 °C
Resistance 30000 Ω 30000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 10% 10%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare TSR8MK303V with alternatives

Compare TSR8NK303V with alternatives