TSR8GF9311V
vs
MR12X9311FGL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TATEYAMA KAGAKU GROUP
WALSIN TECHNOLOGY CORP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
3.2 mm
3.1 mm
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
Tape
TR, PAPER, 13 INCH
Rated Power Dissipation (P)
0.25 W
0.25 W
Resistance
9310 Ω
9310 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Rohs Code
Package Description
CHIP
HTS Code
8533.21.00.30
Additional Feature
ANTI-SULFUR, RATED AC VOLTAGE (V): 200
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Rated Temperature
70 °C
Reference Standard
AEC-Q200; MIL-STD-202
Surface Mount
YES
Terminal Finish
TIN
Terminal Shape
WRAPAROUND
Compare TSR8GF9311V with alternatives
Compare MR12X9311FGL with alternatives