TSR4GF30R9V
vs
RK73H2ETTDB30R9F
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TATEYAMA KAGAKU GROUP
|
KOA SPEER ELECTRONICS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.6 mm
|
| Package Length |
3.2 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.5 mm
|
2.6 mm
|
| Packing Method |
Tape
|
TR, 13 Inch
|
| Rated Power Dissipation (P) |
0.5 W
|
0.5 W
|
| Resistance |
30.9 Ω
|
30.9 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1210
|
1210
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
MATTE TIN OVER NICKEL
|
|
|
|
Compare TSR4GF30R9V with alternatives
Compare RK73H2ETTDB30R9F with alternatives