TSR3UTD391V vs MCR03ERTD3900 feature comparison

TSR3UTD391V Tateyama Kagaku Group

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MCR03ERTD3900 ROHM Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TATEYAMA KAGAKU GROUP ROHM CO LTD
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature AEC-Q200
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TAPE TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C 70 °C
Resistance 390 Ω 390 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Package Shape RECTANGULAR PACKAGE
Reference Standard TS 16949
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier

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