TSR3GF1652V vs MCR03MZPFX1652 feature comparison

TSR3GF1652V Tateyama Kagaku Group

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MCR03MZPFX1652 ROHM Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TATEYAMA KAGAKU GROUP ROHM CO LTD
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method Tape TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 16500 Ω 16500 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature STANDARD: TS 16949
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard AEC-Q200
Surface Mount YES
Terminal Finish TIN
Terminal Shape WRAPAROUND

Compare TSR3GF1652V with alternatives

Compare MCR03MZPFX1652 with alternatives