TSR2GF3162V vs MC2010-3162-FB101W feature comparison

TSR2GF3162V Tateyama Kagaku Group

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MC2010-3162-FB101W RCD Components Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer TATEYAMA KAGAKU GROUP RCD COMPONENTS INC
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.6 mm
Packing Method Tape BULK
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 31600 Ω 31600 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Package Description CHIP, ROHS COMPLIANT
HTS Code 8533.21.00.30
Additional Feature PRECISION
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND

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Compare MC2010-3162-FB101W with alternatives